Snapdragon 8 Gen 4 Specs and Features Leaked, Including Oryon CPU

Snapdragon 8 Gen 4 Specs and Features Leaked, Including Oryon CPU

Qualcomm's upcoming Snapdragon 8 Gen 4 chipset is set to introduce significant advancements in mobile processing, featuring the new Oryon CPU cores developed by the Nuvia team within Qualcomm. According to leaked details from the Mobile World Congress (MWC) 2024, the Snapdragon 8 Gen 4 will utilize a 3nm process node likely produced by TSMC. The chipset will feature a 2+6 CPU configuration with two Oryon cores clocked at 4.09GHz and six additional cores, promising enhanced performance and efficiency. The GPU will be the Adreno 830, expected to deliver superior graphics performance and power efficiency. Two variants, SM8750 and SM8750P, are planned, with the latter being an optimized version for the upcoming Samsung Galaxy S25 series.

Further leaks reveal that the Snapdragon 8 Gen 4 will include the FastConnect 7900 modem, supporting Wi-Fi 7 and Bluetooth 5.4, along with Qualcomm's advanced Spectra ISP for upgraded camera capabilities. The chipset will also support quad-channel LPDDR5X RAM and feature a Low-Power AI subsystem for always-on tasks such as audio processing and sensor tracking. Benchmark results suggest a 35% improvement in single-core performance and a 30% increase in multi-core tasks compared to its predecessor. The first smartphone to feature the Snapdragon 8 Gen 4 is expected to be the Xiaomi 15, slated for launch in October.

In addition to the Snapdragon 8 Gen 4, Qualcomm is also preparing to release the Snapdragon 7s Gen 3, the successor to the Snapdragon 7s Gen 2. The new chipset is expected to offer a 20% improvement in CPU performance, 40% faster GPU performance, and 30% better AI performance, along with 12% overall power savings. The Snapdragon 7s Gen 3 will feature a tri-cluster CPU setup, Adaptive Perf Engine 3.0 with VRS Pro and AFME for gaming, and enhanced audio features including Spatial audio support and lossless audio. It will also come equipped with a 5G Modem-RF system, Bluetooth v5.4, and Qualcomm’s FastConnect system.

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